LED injection molding module is a high-precision product. It has its own specifications and requirements in the production process, including welding, storage, patching, etc. Let's take a look at these specifications and requirements.

one. Precautions for automatic placement and reflow soldering

1. Note that reflow soldering should not exceed two times.

2. In order to ensure the quality and reliability of the LED in the LED injection molding module, it can be packaged with silica gel. The surface of the colloid is soft. During the welding and heating process, do not apply pressure to the surface of the LED in the LED injection molding module.

3. In the selection of suction nozzles, choose a suction nozzle with a suitable size and pressure (try to absorb the plastic part of the product) to avoid causing excessive pressure to damage the product.

two. Manual welding requirements

The LED in the LED injection molding module needs to use a constant temperature soldering iron, the maximum temperature should not exceed 300 ℃, and the welding time should be controlled within 3 seconds. The material cannot be repeatedly welded.

three. Storage conditions

Before opening the package, the LED in the LED injection molding module can be stored for one year under the condition that the temperature does not exceed 30°C and the humidity does not exceed 60%RH. in the wet box.

After opening the package, after unpacking, the LEDs in the LED injection module should complete the placement within 24 hours under the condition of ≤30℃≤70%RH relative humidity, and the unused products are re-vacuum-packed and placed in a sealed container, and a desiccant must be used at the same time. If it is stored for more than 7 days, dehumidification is also required for the next use, and the dehumidification condition is 75℃ for 12 hours (materials with different BINs cannot be mixed at the same time).

Four. take material

In the process of using the LED in the LED injection molding module, the pressure applied to the surface of the LED should be avoided or reduced as much as possible. In addition, any sharp objects should be avoided to pierce the colloid. In short, even if the packaging material is not silicone, it can effectively prevent the glue from being scratched. When using LEDs, it is best to clamp them on both sides for operation. When using a placement machine to assemble, choose a suitable nozzle. It is also very important. Usually, in order to avoid the suction nozzle putting too much pressure on the silicone resin on the LED surface, be sure to choose a suction nozzle that is slightly larger than the surface of the LED gel.

The above are the matters that should be paid attention to in the production of LED injection molding modules. If you need more detailed information on LED injection molding modules, please consult Shenzhen SUNLITE Optoelectronics Co., Ltd. Shenzhen SUNLITE Optoelectronics Co., Ltd. is a company dedicated to LED light boxes. Lighting, sign lighting and decorative lighting products research and development, production, sales and service of high-tech enterprises. Our website is http://en.sunlite-led.com, welcome to consult.