2018 Micro LED Key Elements- Transfer Corresponds to Market Application RequirementsAccording to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Micro LEDNext-Gen Display Technology Market Report- 3Q18 Micro LED Transfer, Driver, Backplane and Application Requirements, the correspondences between each display specification and technologies such as mass transfer, driver and backplane have been discussed. Due to the differences of product properties and specifications for displays, mass transfer, drive and backplane need to correspond according to application characteristics of various display products. Therefore, for different areas of display products, manufacturers are in charge of the future direction of development.
Micro LED Mass Transfer Development Trend
Because currently there are a lot of mass transfer technologies and various properties, according to different display products, there will be relatively suitable solutions. Basically, at the present stage, there are stamp pick & place, laser release, roll to plate, fluidic transfer and wafer bonding. These transfer technologies correspond to various specification requirements of panel. For example, the size of panel is related to the technology of mass transfer for expansion. The height of PPI is related to the sophistication of mass transfer. In addition, resolution is related to the production efficiency of mass transfer. Chip size is related to the size limit of transfer technology for transfer target. Thus, in the future, according to different display products, there will be relatively suitable mass transfer technologies.
Micro LED Backplane Application Trend
The maximum of line width and line space from large to small is as follows: PCB > FPC > Glass > Si CMOS. Thus, owing to the difference of backplanes, the size of display changes. For example, in terms of large-size digital display and TV, because the display size is big, the pixel pitch is larger. There are PCB and glass for them to choose. For middle-size automotive display, glass and FPC are applied instead of PCB. For small-size cell phone and watch, glass and FPC, which are suitable for middle- and small-size display demand, are mainly applied. The backplane display demand of micro-display for AR/VR devices will be below 30 μm. Thus, Si CMOS will be mainly applied. Besides, with the demand of transparent eyeglasses, optical FPC will be needed.
Micro LED Drive Application Trend
By virtue of the continuous improvement of display technology, characteristics of Micro LED drive IC are also varied. Using Micro LED drive IC, the display’s grayscale can reach 16-bit in the case of high refresh rate. If the drive IC is fitted with Lighthouse controller featuring the technology of improving HDR brightness, then it can be obviously seen that the light and shade transition is more smooth, the light area is more bright, and shade area is more deep.
Light source of Micro LED display is in great number. If special drive IC that integrates multichannel design is used, then PCB line spacing and the number of drive IC can be effectively saved and reduced.
When Micro LED turns on, only 10nA is needed for driving power supply. But with such low current, the grayscale is not stable, which will cause failure in lighting up some part of the LEDs and faint light when Micro LED is receiving the same current, so it cannot achieve the design aim. This is the important problem that Micro LED drive IC must overcome.